Features:

• MiJing CH5-C Intelligent Mainboard Layered Welding for Apple iPhone 11 Pro/ 11 Pro Max.
• Solves the problem of repairing/maintaining of the Double – Layered Motherboard structure.
• Takes only 3 minutes to complete the Welding process.
• Fast rise in the temperature and equal heat distribution.
• Does not damage the motherboard.
• Compatible with only Apple iPhone 11 Pro/ 11 Pro Max.